Founded in 1982, MAYA (MAYA Heat Transfer Technologies Ltd) is a leading supplier of advanced thermal and fluid flow analysis software, structural analysis software, and related training and consulting services in mechanical engineering.

MAYA's software and services help thousands of engineers and scientists worldwide to optimize product design early in the development process, enabling them to significantly improve product quality while reducing product development time and cost.

MAYA is dedicated to developing mechanical engineering simulation software solutions that are both powerful and work well with the major CAD/CAE tools on the market. MAYA is a strategic development partner and reseller for UGS PLM Solutions, a world leader in engineering products and services.

MAYA has consistently delivered robust, easy-to-use thermal, fluid flow and structural modeling technology for over 20 years. They lead the market in innovation and annual product enhancements:

• In 1982, the first to deliver an element based, design integrated finite-difference thermal solver technology (TMG Thermal).
• The first to deliver an integrated approach to conduction, convection, duct flow and advanced radiation modeling for the aerospace industry.
• The first to deliver an advanced thermal and fluid flow simulation tool integrated with CAD design tools.
• A leader in electronics cooling simulation using 1D duct flow since 1986.
• The first to introduce a design integrated parametric-based electronics cooling simulation package using thermal and CFD technology (ESC Flow).
• The first to couple finite difference or network based thermal simulation with CFD simulation
• The first unstructured CFD code for electronics cooling supporting a wide range of element types including tetrahedral elements
• The first to introduce domain assembly meshing (DxMesh) for thermal and fluid flow simulation.
• The first to introduce fast and reliable fluid meshing using a project-extrude meshing method (PexMesher).
• The first to introduce advanced spacecraft orbital thermal simulation integrated with a comprehensive thermal simulation package.